芯片制造工艺问答035： Lot to lot, within lot wafer to wafer, within wafer, within field.
Ans (1) lot to lot :不同lot之间的差异性, due to EQ, material, environmental shift(2) within lot waferto wafer:同一个lot中,不同wafer之间的差异性, due to batch run conditional shift. E.g. Lensheating, CVD film thicknes
