学习入门
芯片制造工艺问答024： Vt IMP的目的为何? 对产品电性有何影响?
Ans Vt implant is used to adjust threshold voltage
of transistors, useful in CMOS Vt matching and device current adjusting. Since
it is quite shallow, it can be used without seriously degrading of sub
芯片制造工艺问答023：Sacrificial oxide (SAC oxide) 的目的为何?
Ans Sacrificial oxide was succeeded after SIN-Remove
of both LOCOS and STI process integration, the basic purposes are:Eliminate the defects caused by Kooi Effect (去除在field oxidation过程中, 所产生的white
rib
芯片制造工艺问答022：热磷酸对Si3N4, Oxide的蚀刻率分别是多少? 蚀刻率可控制因子为何?
Ans 50:1 HF E/R 53+-5A/min of SiOxNy = 120~150A, 220sec
to etch 175A SiOxNyH3PO4 E/R is 60+-6A/min for SIN, 1.5 A/min ~0.25
A/min for oxide, for new H3PO4 acid the [Si] is low and oxide E/R is high bu
芯片制造工艺问答018： iline和DUV分别用什么样式的光阻? 试列表比较各光阻特性?
Ans To achieve sub-wavelength lithography results,
resist technology - like the phase shifting masks (PSMs), scanner optics and
inspection techniques - is pushed to its absolute limit. Most importantl
芯片制造工艺问答017：黄光区曝光机共有几种机型? 他们各别有什么任务? 试列表比较其特性?
Ans FAB5 PHO area have 8 EQ model (the information
should be updated according to E3PHO) as attached table:I- line stepper: Default lithographerI- line scanner: for better uniformity and
larger field
芯片制造工艺问答015：STI蚀刻后需检查什么地方以确保蚀刻正常? 这些项目在密集区何疏散区有何不同?
Ans 检查trench
edge, SIN AEI, at high pattern density region, STI profile is more steep,
profile deeper, SIN AEI smaller; at lower density region, STI profile less
steep, SIN AEI larger. 需检查Test
pattern
芯片制造工艺问答014：SiN CVD dep时炉管各部分的温度别控制在什么范围? 为什么如此?
Ans Temperature control divided to three zone:
bottom, center, upper, since gas flow from bottom, in order to compensate the
difference of gas concentration, B-zon
芯片制造工艺问答013： 何谓Epi-Wafer? 对产品有何影响?
Ans Epi_wafer: 在single crystal wafer上再dep一层single crystal SiImprove the performance of bipolar transistor, with
high breakdown voltage of the collector-substrate junction and low collector
resistance.
芯片制造工艺问答012：Pre-Clean的目的为何? 目前共有几种Pre-Clean recipe存在FAB内? 个别的目的有何不同?
Ans Pre-Clean 一般指 Pre furnace/RTP clean.Presently active Pre-clean have 22 recipes; while
dilute APM 1 recipe(see attach file: clean.xls) Pre-clean 为SPM,APM,HPM,HF 依个别需求调整使用时间之clean process, SPM is fo
